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3D Power Packaging Made Real with Embedded Component and Substrate Technologies - P.M. Raj, APEC 2018

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Dr. P.M. Raj, Senior Research Engineer at Georgia Institute of Technology, delivers his keynote presentation on 3D Power Packaging, reliability challenges. Dr. Raj also compares different types of embedding and capacitors.

Visit the APEC website at http://www.apec-conf.org

Dr. P.M. Raj, Senior Research Engineer at Georgia Institute of Technology, delivers his keynote presentation on 3D Power Packaging, reliability challenges. Dr. Raj also compares different types of embedding and capacitors.

Speakers in this video

P. Markondeya Raj

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