Electrically-Pumped 1.31 μm MQW Lasers by Direct Epitaxy on Wafer-Bonded InP-on-SOI Substrate - Yingtao Hu - Closing Ceremony, IPC 2018

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#IEEE #IPC #2018 #photonics #conference #industry #business #technology #computing #lasers #epitaxy #silicon #wafers #integration

Yingtao Hu, Hewlett Packard Labs, speaks on behalf of his colleague’s collaborative work with MQW Lasers and the motivation of transitioning to memory-driven computing. Hu goes into detail on the bonding process and offers a comparative cost analysis.

Yingtao Hu, Hewlett Packard Labs, speaks on behalf of his colleague’s collaborative work with MQW Lasers and the motivation of transitioning to memory-driven computing. Hu goes into detail on the bonding process and offers a comparative cost analysis.

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