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IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs

IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs

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#IMS #Microapps,Microwaves #RF #Conference #Education #Short Courses

IMS 2012 MicroApps presents "Electrical Thermal Coupled Solutions for Flip Chip Designs," by John Fiala and Mike Heimlich.

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