APEC 2015: 3D Packaging 664 views Download Download IEEE.tv is made possible by the Members of IEEE. This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to enable this feature. In addition to exclusive access to IEEE.tv programming, IEEE members have file download, and can save favorite videos with myTV. Discover all the benefits of IEEE membership! Belong to the world's largest technical proffecional society Join / Renew Today Share Embed Static Responsive <iframe src="//ieeetvdev.ieee.org/player/embed_play/129465/auto" allowfullscreen frameborder="0" scrolling="no" width="100%"></iframe> Size: x <iframe src="//ieeetvdev.ieee.org/player/embed_play/129465/auto" allowfullscreen frameborder="0" scrolling="no" width="760" height="430" ></iframe> Copy Close +0 IEEE Industry Applications Society Create Account or Sign In to post comments Brian Narveson, PSMA Packaging Committee Co-Chairman, previews the 3D packaging technology report entitiled "Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies" April 6, 2015
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