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00:16:37
LED Reliability Factors on IMS PCBs
00:29:45
Monitoring the Reliability of Two-Phase Flows using Machine Learning Strategies
00:18:59
Reliability Problems of Optoactive Materials in LED Packaging
00:32:32
Addressing TIM Degradation in Lifetime Prediction of Data Center CPU/GPUs: Testing Methodology, Failure Definition and Performance of TIMs
00:23:38
High Power Cooling with Dynamic Phase Change Materials
00:40:16
Reliability of Microelectronic Interconnections: The Microstructure Matters!
00:24:10
Mechanical Integrity of Hybrid Bonding
00:18:12
Reliability Investigation for Scaling 3D Interconnects in Advanced Semiconductor Packaging
00:23:44
Advanced Packaging Overview: Architectures, Challenges, and Technical Solutions
00:32:47
Computational Modeling of Crack Initiation and Growth in BEOL Structures
00:39:23
Insights into the Reliability of Advanced Glass Packages
00:31:09
Thermal Management of Hybrid Integrated Lasers in Si Photonics
00:15:48
Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the Microbump in 3D IC
00:32:50
Electronic-Photonic Heterogeneous Integration for Co-Packaged Optics for High Performance Computing
00:07:17
Overview of Advanced System Integration and Packaging (ASIP) at Purdue University
00:02:17
Closing Remarks - IEEE CTU Summit 2024
01:05:34
Panel - IEEE CTU Summit 2024
00:05:43
Way Forward Mentoring Programs - IEEE CTU Summit 2024
00:29:50
CTU Challenge Winners - IEEE CTU Summit 2024
00:18:12
Readout of Breakout Sessions - IEEE CTU Summit 2024
00:31:48
Keynote Maneesha V. Ramesh - IEEE CTU Summit 2024
00:30:08
Keynote Naveed Haq - IEEE CTU Summit 2024
00:29:14
Keynote Karim Rifai Burneo - IEEE CTU Summit 2024
00:20:18
Opening Remarks - IEEE CTU Summit 2024
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