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00:24:02
Micro Pillar Support Structure for Mechanical Reliability of Silicon Ultra-Thin Vapor Chambers
00:30:58
Testing Heterogeneous Integration and Supply Chain Implications
00:47:02
In-Vehicle Display Technology Development and Challenges
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Silicon Photonics: Integration, Reliability Challenges and Future Requirements
01:43:38
Tutorial: Achieving High Reliability for Lead-Free Solder Joints: Materials Considerations
00:23:03
Correlation Between Delamination and Solder Joint Fatigue of QFN Package
00:36:17
Thermo-mechanical Analyses on Mounted Flip-Chip BGA Applicable in High Performance Vehicle Computers
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Overview and Challenges of Silicon Photonics Device Reliability
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Analysis of Flexible PCBs: Trace Reinforcement Approach
00:27:11
Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics
00:28:07
Advanced Package Technologies and their Reliability Challenges
00:26:09
Introduction of ISPG Method and Geometric Multiscale Modeling for Electronics Solder Reflow and Shock Wave Analysis
00:21:44
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages
00:29:14
Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction
01:01:14
Random Failure Reduction: Strategy for Advanced Semiconductor Devices Production
01:02:23
Cross-Layer ESD Protection Designs: Chips, Packaging and Systems
01:13:02
Workshop at REPP: The IEEE Heterogeneous Integration Roadmap
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REPP: Making Digital Twins Work
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Welcome to REPP 2021 (Symposium on Reliability of Electronics and Photonics Packaging)
00:53:00
Quantum Fiber-Optic Interconnect Technology For Quantum Networks
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IEEE EAB Awards Experience 2021
00:06:37
2021 IEEE HAC Global Summit - Evening Session Closing Remarks
00:39:40
2021 IEEE HAC Global Summit - Fireside Chat with IEEE HAC Leaders
00:18:45
2021 IEEE HAC Global Summit - Evening Session Opening Remarks
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