Accelerating Electronics & Photonics Innovation for Revolutionary Microsystems

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#DARPA #advanced packaging #heterogeneous integration #5G #photonics #3D integration #thermal #test #new materials #SiP #2.5D #sensors

--disruptive advances, next-gen computing, communications, skey prgms, investments ... Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium by Gordon A. Keeler, Prgm Manager, Defense Advanced Research Projects Agency (DARPA)

The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February, 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI.

The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia.

The Roadmap is available without charge. Access videos at https://ieee-region6.org/scv-eps/?p=2416.

--disruptive advances, next-gen computing, communications, skey prgms, investments ... Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium by Gordon A. Keeler, Prgm Manager, Defense Advanced Research Projects Agency (DARPA)

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