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The Origins of Silicon Valley: Characteristics of a Startup Environment
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Challenges and Recent Perspectives of 3D Heterogeneous Integration
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Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging
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Thermal and Failure Analysis of Advanced Microelectronic Devices
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Quality and Reliability Assessment of Sintered Nanoporous-Copper Interconnects on Substrates
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Thermal Oscillations and Reliability for Capillary-driven Boiling in Microporous Wicks
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Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling
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Interconnect Reliability: From the Chip to the System
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Failure-Oriented-Accelerated-Tests (FOATs) and their Roles in Making a Viable IC Package into a Reliable Product
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Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced Failures
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Mars 2020 Perseverance Rover: Thermal Cycle Life Qualification
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Test technologies for Ensuring Quality and Reliability
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FE-Modeling Validation of Innolot Deformation Behavior with TMF Testing under Cyclic Shear-Dominant Thermomechanical Loading
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Addressing Thermal Challenges for Co-packaging Processes on Glass Substrates
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Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism
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Reliability Challenges of Advanced Silicon Photonics Devices
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Heterogeneous Integration Roadmap Update: Chapter on Reliability
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A Study of Thermal Analysis Modeling Method for Press-pack IGBT Modules Considering Contact Surface Damage
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Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling
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00:25:22
Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration
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Baking Time Study for Moisture-Sensitive Packages
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Advanced Methodology for Assessing CPI-Induced Stress Effects on Chip Performance and Reliability
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