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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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00:35:41
Scalable X-Ray Characterization for Device Reliability and Failure Analysis
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00:26:03
New HALT with Physics of Failure (PoF) for Electronics
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00:32:42
Types of Environmental Testing with an In-Depth Look at Skewed Fixture for HALT
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00:22:24
Analysis of Depolarization and the Fundamental Advantage of Mueller Matrix Ellipsometry for Thin Film Metrology
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00:19:42
Apex-Hybrid: An Advanced X-ray Imaging System with Dual-Mode Imaging Modality
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00:16:52
Physical Understanding of Bleed from Thermal Interfaces
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00:23:38
Quantifying Burn-In of Phase Change Thermal Interface Materials
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00:24:50
IMS Printed Circuit Board Solder Fatigue Validation
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00:28:14
Short- and Long-Term Stability of NTC Chip-Scale Thermistors
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00:22:37
Perturbation of the Electrostatic Potential distribution in HV-ICs Induced by Space Charge in Epoxy Packaging
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00:28:47
Development of Standardized and Scalable Glass-based Technology for the Next-generation Electronic-Photonic Systems in a Package
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00:30:05
Reliability Optimization of Open Trench Undercuts Silicon Photonic Tuner Heater
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00:28:21
Metrology Challenges in Advanced Packaging: Focus on Die-to-Die and Die-to-Wafer Bonding
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00:25:41
Analytical Modeling of Thermal Stress in Cu TSVs Incorporating Grain Orientation Anisotropy
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00:27:23
Heterogeneous Packaging for Data Center Applications
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00:35:09
Process and Reliability of Cu-SiO2 Hybrid Bonds for 3D IC Heterogeneous Integration
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00:24:15
A Hybrid Prognostics and Health Management Model to Predict Drop-induced Degradation in Ball Grid Array Interconnects
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00:28:48
Trends and Challenges in Interconnect Reliability under 24nm pitch: Copper Extendibility and Subtractive-Ruthenium/Airgap Approaches
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00:34:48
Effect of Underfill and Bump Density on Electromigration and Thermomigration Failures in Thermo-Compression Bonded Cu Microbumps for 3D-HI
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00:36:29
Reliability of Advanced Glass Packages: Past, Present and Future
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00:39:03
Panel: Silent Data Corruption (SDC) Testing Strategies for AI Hardware
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00:24:45
Power Temperature Cycling of Automotive Microelectronics
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