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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Computational Modeling of Crack Initiation and Growth in BEOL Structures
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00:39:23
Insights into the Reliability of Advanced Glass Packages
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Thermal Management of Hybrid Integrated Lasers in Si Photonics
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Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the Microbump in 3D IC
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Electronic-Photonic Heterogeneous Integration for Co-Packaged Optics for High Performance Computing
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Overview of Advanced System Integration and Packaging (ASIP) at Purdue University
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Electromigration and Thermomigration Behavior of Cu Microbumps in Stacked Die Assembly
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HALT and TC Reliability of QFN Assemblies with and without Urethane Coating
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Fault Isolation and Failure Analysis Challenges in Microelectronic Devices with Heterogeneous Integration: EDFAS FA Technology Roadmap Overview
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GDS Factory: Build Better Hardware with Better Software
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Mechanical Cycling to Facilitate Accelerated Degradation of TIMs
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Characterization and Modelling of Epoxy Mold Compounds for High-Voltage Integrated-Circuit Packages
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Pool Boiling Performance and Reliability of Copper and Nickel Inverse Opal Structures
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Cryogenic CMOS Technologies for Quantum Computing Systems
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Experiences of Electronics Packaging at Scania: Challenges and Opportunities
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Convergence of Performance, Efficiency and Reliability with Passive Two-phase DTC Cooling
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Reliability Modeling of Electronics Cooling Systems in Data Centers
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Reliability of Bonded Interface Materials for Power Electronics
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Using AI to Address Thermal Challenges in Data Center SoCs
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Reliability for Thermal Interface Materials
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Reliability and Availability of Novel Data Center Cooling Systems
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00:58:12
The Application of Simulation and Artificial Intelligence in Advanced Packaging
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