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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 133 - 154 of 260
00:37:36
Thermal and Failure Analysis of Advanced Microelectronic Devices
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00:39:52
Quality and Reliability Assessment of Sintered Nanoporous-Copper Interconnects on Substrates
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00:19:39
Thermal Oscillations and Reliability for Capillary-driven Boiling in Microporous Wicks
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00:20:31
Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling
456 views
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00:41:32
Interconnect Reliability: From the Chip to the System
79 views
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00:48:02
Reliability Outlook and Challenges for Monolithic SiPh Applications in Foundary Viewpoint
76 views
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00:25:38
Failure-Oriented-Accelerated-Tests (FOATs) and their Roles in Making a Viable IC Package into a Reliable Product
11 views
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00:23:00
Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced Failures
21 views
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00:26:30
Mars 2020 Perseverance Rover: Thermal Cycle Life Qualification
13 views
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00:33:09
Test technologies for Ensuring Quality and Reliability
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00:21:06
FE-Modeling Validation of Innolot Deformation Behavior with TMF Testing under Cyclic Shear-Dominant Thermomechanical Loading
6 views
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00:22:55
Addressing Thermal Challenges for Co-packaging Processes on Glass Substrates
31 views
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00:40:08
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism
56 views
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00:48:01
Reliability Challenges of Advanced Silicon Photonics Devices
135 views
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00:26:09
Heterogeneous Integration Roadmap Update: Chapter on Photonics Packaging
160 views
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Heterogeneous Integration Roadmap Update: Chapter on Reliability
51 views
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00:40:42
A Study of Thermal Analysis Modeling Method for Press-pack IGBT Modules Considering Contact Surface Damage
33 views
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00:14:01
Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling
42 views
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00:25:22
Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration
36 views
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00:24:27
Baking Time Study for Moisture-Sensitive Packages
42 views
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00:22:56
Advanced Methodology for Assessing CPI-Induced Stress Effects on Chip Performance and Reliability
23 views
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00:38:32
Emerging Challenges on Thermal Modeling and Simulation for Advanced 3DIC Systems
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