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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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Showing 177 - 198 of 289
00:39:38
Heterogeneous Integration Roadmap Update: Chapter on Reliability
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00:40:42
A Study of Thermal Analysis Modeling Method for Press-pack IGBT Modules Considering Contact Surface Damage
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00:14:01
Thermomechanical Modeling and Reliability Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling
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00:25:22
Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration
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00:24:27
Baking Time Study for Moisture-Sensitive Packages
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00:22:56
Advanced Methodology for Assessing CPI-Induced Stress Effects on Chip Performance and Reliability
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00:38:32
Emerging Challenges on Thermal Modeling and Simulation for Advanced 3DIC Systems
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00:13:30
Investigation of Thermal-Fatigue Properties of SnBiAgCu Solder Alloys
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00:23:10
Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading
30 views
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00:24:11
Mechanical and Condensation Challenges for Autonomous Vehicle Reliability
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00:36:53
Silicon Photonics Reliability Requirements for Datacom and Telecom Applications
263 views
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00:37:02
Additive Manufacturing Technologies for Custom-made Electronic Packaging -– Processes and Reliability
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00:09:46
Welcome: IEEE/EPS Symposium on Reliability for Electronics and Photonics Packaging (2022)
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00:09:20
Welcome: IEEE/EPS Symposium on Reliability for Electronics and Photonics Packaging
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02:13:13
Tutorial: Reliability Physics and Failure Mechanisms in Electronics Packaging
822 views
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01:15:29
Characteristics of Successful Tech Hubs and Start-Ups: Lessons from the Origin and Growth of Silicon Valley
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00:34:43
Overview of Co-Design of Electronics Systems, and NSF Proposal Review
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00:55:02
The Future of Hardware Technologies for Computing: N3XT 3D MOSAIC, Illusion Scaleup, Co-Design
106 views
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01:01:41
A 3D Heterogenous Integration Future: Enabling Continued Scaling of Electronics Systems
438 views
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00:56:52
Semiconductor Packaging Technology: The Future Is Now
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00:57:33
Flexing, Bending And Stretching Toward Advances In Electronics For Medical And Industrial Applications
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01:05:33
Challenges and Innovations in Microprocessor Power Delivery
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