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IEEE Electronics Packaging Society
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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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00:33:22
Convergence of Performance, Efficiency and Reliability with Passive Two-phase DTC Cooling
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00:21:16
Reliability Modeling of Electronics Cooling Systems in Data Centers
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00:27:54
Reliability of Bonded Interface Materials for Power Electronics
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00:25:14
Using AI to Address Thermal Challenges in Data Center SoCs
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00:35:16
Reliability for Thermal Interface Materials
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00:30:35
Reliability and Availability of Novel Data Center Cooling Systems
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00:58:12
The Application of Simulation and Artificial Intelligence in Advanced Packaging
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00:33:55
The Heterogeneous Integration Roadmap: Understanding Future Requirements in Advanced Packaging
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00:53:51
Increasing Role of Silicon Photonics and Criticality of Advanced Packaging Technologies to Meet Future Compute Demands
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00:02:25
IEEE Electronics Packaging Society: Designing the Future
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00:55:57
Thermal Challenges and Opportunities: From Chip to Facility
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Advancing Opto-Electronics With Thermo-Electric Technology
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00:47:36
Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection
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00:25:44
T-CPMT Podcast: Controlling Underfill on Die in Multi-chip Heterogenous Integration with Large Die Height Delta A Paper Summary
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00:54:12
2.5D Silicon Photonics Interposer Flip Chip Attach
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00:53:40
Chemical Mechanical Polishing (CMP) for Hybrid Bonding
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00:52:15
Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling
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01:17:35
Characteristics of Successful Tech Hubs and Start-ups: Silicon Valley Lessons for Toronto
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01:14:35
Characteristics of Successful Tech Hubs and Start-ups: Lessons for Toronto from the Origin and Growth of Silicon Valley
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01:08:02
Thermal Challenges and Advanced Cooling Opportunities for 2.5D and 3D High Performance Computing
119 views
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01:02:40
Using Diamond in Advanced Packaging: Current Developments and Status
128 views
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00:47:14
Co-Packaged Optics: Heterogeneous Integration of Photonic ICs and Electronic ICs
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