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01:19:53
The Origins of Silicon Valley: Characteristics of a Startup Environment
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00:51:57
Rugged Packaging Solutions for Radar Sensors in Diverse Applications and Environments
81 views
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00:52:08
Advanced Power Electronics and Electric Machines for Electric-Drive Mobility Applications
53 views
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00:58:36
Interconnect Reliability in Advanced Packaging and Heterogeneous Integration
116 views
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00:58:48
Design Rules and Acceleration for Electromigration-Induced Failure: Coupled Modeling and Experimental Verification
102 views
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00:59:08
High-resolution X-ray Computed Tomography (XCT) for Fault Isolation in Advanced Packaging
65 views
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00:52:35
Introduction to the Digital Camera: Technology, Packaging, Challenges
112 views
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01:03:16
Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size
414 views
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00:45:41
Using Glass Carriers for Precision Wafer Thinning and Warpage Control
138 views
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00:59:32
The Origins of Silicon Valley: Roots in Ham Radio
154 views
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00:31:36
Packaging Challenges in Quantum Computing
147 views
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00:44:46
High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem
144 views
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00:28:51
Heterogeneous Integration Platform for Next Generation Computing ('Beyond Moore')
392 views
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00:38:49
Basic Research in Microelectronics
32 views
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00:34:41
A Framework for the Organization and Execution of the CHIPS Act-related National Advanced Packaging Manufacturing Program
56 views
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00:33:31
A Roadmap for Heterogeneous Integration for the Next Decade and Beyond – An Academic Perspective
88 views
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00:31:36
Heterogeneous Integration Development: Interdisciplinary Innovations
70 views
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00:19:37
Introduction: Sixth Annual Symposium on Heterogeneous Integration
77 views
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00:28:12
Update on the CHIPS Research and Development Programs
55 views
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00:32:51
Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
510 views
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01:48:56
Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
601 views
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00:13:51
Challenges and Recent Perspectives of 3D Heterogeneous Integration
116 views
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00:13:40
Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging
35 views
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